Electro Scientific Industries (ESI) offers the latest laser-drilling technologies to the high-density interconnect (HDI) and advanced packaging markets, enabling customers to shrink pad design for increased density of circuit boards and electronic packages. ESI's model 5330 UV laser µvia drill incorporates a high-power diode-pumped laser with pulse repetition frequency of up to 70 kHz and can cut copper with excellent quality and productivity rates of up to 15,000 vias per minute. The system is designed with the capability to have various optical configurations to meet the needs of HDI and IC packaging markets. The optional shaped-beam capability guarantees excellent quality, improves registration, and produces highly circular vias, high throughput, and excellent bottom copper quality with no resin residue. No external water or gas is needed, allowing for easy installation and low operating costs.

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